It is a system to treat waste water generated from cutting and polishing processes of silicon wafer during dicing saw process in the manufacture of semiconductors. This system is a new system and different from the conventional type. It passes waste water through filter and recycles the water. The structure of this equipment is simple and its energy and operation costs are low and it is easy to maintain.
In addition, the sludge acquired from the waste water can be recycled through material recycling process as usable products.
100 % recycling of waste water is possible
[Minute particle in waste water]
Drastic reduction of operation cost is possible.
Realization of low energy use in waste water treatment.
Realization of waste water treatment without using any chemicals.